• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    This method comprises the steps of: a) providing a support substrate (1) comprising a receiving face (2), b) depositing a release layer (4) on the receiving face (2), the release layer (4) comprising a central region (5) and a peripheral region (6), and c) Trimming the support substrate (1) so as to remove the peripheral region (6) from the release layer (4) and form at the periphery of the support substrate ( 1) a recess (9), to obtain the substrate-handle (100). The present invention also relates to a method of temporarily bonding a substrate (3) to the handle substrate (100) manufactured according to the method as previously described. The present invention further relates to the handle substrate (100) manufactured according to the method as previously described.
    公开号:FR3015110A1
    申请号:FR1362845
    申请日:2013-12-17
    公开日:2015-06-19
    发明作者:Pierre Montmeat；Laurent Bally；Frank Fournel；Michel Pellat
    申请人:Commissariat a lEnergie Atomique CEA；Commissariat a lEnergie Atomique et aux Energies Alternatives CEA；
    IPC主号:
    专利说明:

    [0001] The present invention relates to a method of manufacturing a substrate-handle for temporarily bonding a substrate, in particular for applications in the fields of electronics, optics or optoelectronics. The invention also relates to a method of temporarily bonding a substrate to the substrate-handle and further aims a substrate-handle for temporary bonding of a substrate, as obtained by this method of manufacture. Recent advances in microelectronics require the formation and manipulation of ultra thin substrates, the thickness of which may be in particular between 50 and 150 micrometers. These ultra-thin substrates are indeed difficult to handle on the production lines and with standard tools conventionally used. In addition, depending on the nature of the materials constituting these ultra fine substrates, the latter are sometimes so flexible that they curl on themselves at rest, making their use delicate. To remedy this, a temporary bonding technique makes it possible to hold it in place on a support substrate by means of an adhesive polymer layer. It is then possible to manipulate the stack formed with standard tools and to perform technological steps on the substrate. Once the thinning and the steps for the manufacture of electronic components made, the substrate is peeled off its support substrate. The detachment is conventionally done with a sequence of chemical and mechanical actions. More specifically, a method known under the name Zone Bonde technology proposes a temporary bonding from a support substrate prepared according to the following steps: 1-Deposition of a resin in the peripheral zone of a support substrate, for example made of silicon or glass, over a width of 15 to 50 mm, 2- Deposition of a generally fluorinated non-stick compound on the central part of the support substrate, 3- Drying and rinsing of the non-stick compound, 4- Peeling of the resin in the peripheral zone with a suitable solvent, and 5 drying the support substrate.
    [0002] A support substrate which has a non-stick area in the center and a silicon crown (or glass) untreated on a peripheral area is thus obtained. This crown then ensures adhesion during bonding with the substrate on which an adhesive has been previously spread. Once the desired treatments have been carried out on the substrate, a chemical attack at the peripheral portion of the stack weakens the bonding. Combined with the low adhesion obtained by the presence of the release layer, this attack makes possible the mechanical detachment of the substrate from its support. A known alternative to this process consists in carrying out the following steps: 1-Deposition of an adhesive component on the peripheral part of a support substrate, 2-drying of the adhesive, 3-Deposition of a non-stick component on the part center of the support substrate, and 4- Drying and rinsing the non-stick component. The carrier substrate thus obtained has a nonstick area in the center and an adhesive crown on a peripheral area so that it is not necessary to spread an adhesive component on the substrate.
    [0003] A second variant of the process can be envisaged with the following steps: 1 - Deposition of a release component on a support substrate 2 - Drying and rinsing of the release component 3 - The peripheral part of the antiadhesive component is removed by etching with a solvent of the anti-adhesive, 4. Drying of the support substrate, 5-Deposition of an adhesive component on the peripheral portion of the support substrate, and 6-drying of the adhesive component.
    [0004] A support substrate having a central non-stick area an adhesive crown on a peripheral area is then obtained for bonding with a substrate.
    [0005] However, these steps are long and painstaking. Indeed, the quality of the bonding and then the quality of the detachment depend on the accuracy and homogeneity of the dimensions of the peripheral ring formed along the periphery of the support substrate. Furthermore, bringing the substrate and the support substrate into contact via an adhesive layer leads to the formation of an adhesive bead on the periphery of the stack that prevents the adhesive material from reaching a good flatness and modifies the homogeneity of the collage. The present invention aims to remedy at least one of the aforementioned drawbacks. To this end, it proposes a method of manufacturing a substrate-handle intended for the temporary bonding of a substrate, the method comprising the steps of: a) Providing a support substrate comprising a reception face, b) Depositing a layer anti-adhesive layer on the receiving face, the release layer comprising a central region and a peripheral region, and c) Trimming the support substrate so as to remove the peripheral region of the release layer and form a recess at the periphery of the support substrate, in order to 'get the substrate-handle. Thus, this method makes it possible to form a non-adhesive central portion on the support substrate and a peripheral cut-off portion, making it possible to receive the excess adhesive during bonding with the substrate so as to improve the flatness of the interface. In addition, this method is simple to implement and avoids performing a large number of preparation steps. The recess formed may have different types of shapes, such as a step-like profile, a bevel, or a curved shape. Preferably, the recess formed in step c) comprises removing material from the periphery of the support substrate and the peripheral region of the release layer so that the recess has a width L, measured from the periphery towards the center support substrate, substantially constant. By substantially constant, it is meant in the document that the width L varies by plus or minus 10 microns on the peripheral periphery of the support substrate. According to one possibility, the recess formed in step c) has a height H of between 1 and 50 micrometers and a width L of between 1 and 50 mm. The height H is measured in a direction substantially perpendicular to the plane of the receiving face and the width L is measured in a radial direction. This height range H makes it possible to receive the surplus of adhesive and this range of width L ensures optimum bonding energy both for carrying out treatments on the substrate and for ensuring easy and good separation. Preferably, the removal of material is carried out so that the width L varies at most by plus or minus 1 micrometer. The homogeneity of the width L obtained guarantees uniform subsequent bonding with the substrate, which then facilitates peeling by chemical etching or application of mechanical stress to the bonding interface between the substrate and the handle substrate. According to one possibility, the recess formed in step c) has a bottom whose roughness is between 1 and 500 nanometers RMS (English acronym for Root Mean Square) and preferably between 1 and 100 nanometers RMS. This roughness is particularly favorable for bonding with the substrate. All RMS roughnesses described in this document are determined by AFM atomic force microscopy on a field of 20x20 micrometers. According to one possibility, the clipping of step c) is carried out by means of machining tools, such as a clipping saw or a grinder. This method is inexpensive and provides a great homogeneity in the removal of peripheral material. The width L of the trimming is obtained with a variation of only 10 microns and the height H with a variation of only 1 to 2 microns. Alternatively, the clipping of step c) is performed by a photolithography step followed by an ion etching or chemical etching step. This method allows a precision of the homogeneity of the dimensions of the width L and the height H less than 1 micrometer. According to yet another alternative, the clipping of step c) is carried out by a step of implanting ionic species, such as hydrogen, through the peripheral region of the nonstick layer followed by a treatment step Thermal exfoliation. Here again, this method is very precise since it makes it possible to obtain a variation of the width L and of the height H less than one micrometer. Advantageously, the release material is a fluorinated or non-fluorinated organosilane such as Octadecyl TricholoroSilane (OTS) or a fluorinated or non-fluorinated polymer such as the 2702 Electronic Grade Coating polymer (supplied by 3MTm). Preferably, the support substrate comprises a material selected from silicon, silica, glass, sapphire, germanium or a metal. This wide choice of support substrate makes it possible to adapt the method according to the coefficient of thermal expansion in relation to that of the substrate, the thermal and mechanical resistance necessary for the rest of the process. According to a second aspect, the present invention also relates to a method of temporarily bonding a substrate to a substrate-handle, comprising the steps of: d) Providing the substrate-handle manufactured as previously described, e) Providing the substrate comprising a rear face and a front face, the front face being intended to receive electronic components, f) depositing an adhesive layer on the rear face of the substrate, and / or on the face of the handle substrate comprising the recess, and g ) Contacting the rear face of the substrate and the face of the handle substrate having the recess via the adhesive layer so as to obtain the temporary bonding of the substrate to the substrate-handle. This method makes it possible to prepare in parallel the support substrate 30 and the substrate to be bonded so as to optimize the duration of the process. The contacting of the substrate with the substrate-handle allows the adhesive layer to be distributed over the release layer and the surplus fill the recess until reaching the bottom of the recess whose roughness is optimal for bonding. This method creates a low energy bonding interface region at the nonstick layer core region and high bonding energy at the recess. By the term 'electronic components' is meant herein both complex components such as CMOSs, memories, and simple components such as an electrical interconnection. The electronic components may be made by microelectronic processes including, but not limited to, etching, deposition, cleaning or other steps. Advantageously, the substrate comprises a material chosen from silicon, silica, glass, sapphire, germanium or a metal such as molybdenum, tungsten and copper, for example. The latter may have already undergone prior preparatory steps on the backside to be glued or on the front face, such as patterning in English. According to one arrangement, the adhesive layer comprises a material selected from HT1010 or ZoneBond® 51.50 or WaferBOND® CR200, supplied by Brewer Science. Advantageously, the method comprises, after step g), a step h) of applying to the front face of the substrate at least one processing step intended for the manufacture of electronic components, such as a rectification, a thinning, a chemical mechanical polishing, etching, dielectric or metal deposition, pattern formation, passivation, heat treatment, or a combination of at least one of these treatments. The temporary bonding of the substrate on the substrate-handle makes it possible to fix and hold the substrate in place for the realization of component manufacturing steps. Preferably, the method comprises after step g), a step i) of etching and / or applying a mechanical stress so as to separate the substrate from the substrate-handle.
    [0006] The mechanical stress may consist of the application of a blade at the interface between the substrate-handle and the substrate, a tensile force or a shear force. It can be applied for example by imposing a curvature on the assembly formed of the substrate and the substrate-handle, for example by stamping on a suitable preform. According to one possibility, step g) further consists in applying a heat treatment under vacuum with a compression, for example 6 kN, to the stack formed by the substrate bonded to the substrate-handle. Preferably, the method comprises after step i), a step j) of cleaning the substrate-handle to remove the glue residue so that the substrate-handle can be reused in step d). This cleaning, in particular carried out by successive rinsing in an isopropanol solution and in a limonene solution, makes it possible to remove the portion of the adhesive layer transferred onto the substrate-handle during bonding. Thus, after the cleaning, a substrate-handle as provided in step c) of the process is recovered. Advantageously, the method comprises a step k) carried out after step j) of repeating at least once steps d) to i) allowing the recycling of the substrate-handle for the temporary bonding of a new substrate. According to a third aspect, the invention relates to a substrate-handle intended for the temporary bonding of a substrate, the substrate-handle comprising a support substrate whose periphery has a recess delimiting a central portion of the support substrate which is covered with a substrate. nonstick layer, the recess being devoid of nonstick layer. Preferably, the recess has a width L, measured from the periphery to the center of the support substrate, of between 1 and 50 mm, the width L varying by plus or minus 1 micrometer along the peripheral periphery of the support substrate. Furthermore, the recess has a height H of between 1 and 50 microns and varies by plus or minus 1 micrometer along the peripheral periphery of the support substrate.
    [0007] The height H is measured in a direction substantially perpendicular to the plane of the support substrate. The height H can also be measured in a direction perpendicular to the width L of the recess. Advantageously, the recess has a bottom whose roughness is between 1 nanometer and 500 nanometers RMS. According to yet another aspect, the invention relates to a removable stack comprising a substrate-handle as described above and a substrate comprising a rear face and a front face intended to receive electronic components, the rear face of the substrate being bonded to the substrate. handle and to the recess by an adhesive layer. Other aspects, objects and advantages of the present invention will appear better on reading the following description of two embodiments thereof, given by way of non-limiting examples and with reference to the appended drawings. The figures do not necessarily respect the scale of all the elements represented so as to improve their readability. In the remainder of the description, for the sake of simplification, identical, similar or equivalent elements of the various embodiments bear the same numerical references. Moreover, all the bonding energies described in this document are determined by the technique of the double lever with forced displacement (method of insertion of wedge or method of Maszara). FIG. 1 illustrates a schematic sectional view of a support substrate for the manufacture of a handle substrate according to step a) of one embodiment of the invention.
    [0008] FIG. 2 illustrates a schematic sectional view of a support substrate covered with a release layer according to step b) of one embodiment of the invention. FIG. 3 illustrates a schematic sectional view of a support substrate cut in accordance with step c) of one embodiment of the invention.
    [0009] FIG. 4 illustrates a schematic sectional view of a substrate bonded to a substrate-handle according to steps d) to g) of one embodiment of the invention.
    [0010] FIG. 5 illustrates a schematic sectional view of the application of a treatment to the substrate according to step h) of one embodiment of the invention. FIG. 6 illustrates a schematic sectional view of the separation of the substrate-handle and the substrate according to step i) of an embodiment of the invention. As illustrated in FIG. 1, a support substrate 1 comprising a reception face 2 is provided according to step a) of the method. The material of the support substrate 1 is made of silicon but it can also be made of silica, glass, sapphire, germanium or a metal such as molybdenum, tungsten and copper, depending on the nature of the substrate 3 to be bonded and subsequent operations. desired. As illustrated in FIG. 2, a release layer 4 is deposited on the receiving face 2 of the support substrate 1. The release layer 4 comprises a central region 5 and a peripheral region 6 covering respectively a central portion 7 and a peripheral portion 8 of the support substrate 1. This release layer 4 comprises a release material, such as an organosilane compound selected from OTS supplied by Sigma Aldrich. The OTS layer 4 is for example deposited by immersion of the substrate 3 for 5 minutes in a solution of OTS diluted in isooctane and having a concentration of 5.10-3 mol / l. A nonstick layer 4 having a thickness of between 1 and 10 nanometers is then obtained. According to one variant, the non-stick layer 4 is made of 2702 Electronic Grade Coating polymer supplied by 3M ™ and is deposited by Spin Coating (or Spin Coating in English terminology) until a release layer 4 having a non-stick coating is obtained. a thickness of about 5 nanometers. Once the release layer 4 has been deposited, the support substrate 1 is air-dried for about 30 minutes. As illustrated in FIG. 3, the support substrate 1 is cut away so as to remove the peripheral region 6 of the release layer 4 and the material of the support substrate 1 so as to form a recess 9 on a height H (measured in a direction substantially perpendicular to the plane of the receiving face 2) and a width L (measured in a direction of the periphery towards the support substrate center (1) and oriented substantially parallel to the plane of the receiving face 2) so as to produce a substrate-handle 100 (step c). This step of trimming is carried out using a machining tool, for example a standard diamond type trimming saw (width 1.5 mm, supplied by DISCO) until recessing 9 with a height H of 7 micrometers (measured in a direction perpendicular to the width 10 L) and a width L of 15 mm. Alternatively, a machining tool such as a grinder can be used. These current microelectronic tools are simple to use and allow to obtain a high accuracy of low cost clipping. The height H of the recess 9 is indeed constant along the peripheral periphery of the support substrate 1 to two micrometers. Similarly, the width L of the recess 9 is constant to 10 micrometers. The handle substrate 100 thus obtained is formed of a support substrate 1 which has a recess 9 with a step-shaped profile whose dimensions are homogeneous around the peripheral periphery of the support substrate 1. This is particularly useful for the quality of the substrate. bonding and detachment with a substrate 3. According to an alternative, the clipping of the support substrate 1 is carried out by a photolithography step followed by an ion etching or chemical etching step. This technique also makes it possible to improve the homogeneity of the width L and of the height H of the recess 9, which are then constant to within 1 micrometer along the periphery of the support substrate 1. According to yet another alternative, not illustrated, the clipping is obtained by implantation of ionic species through the peripheral region 6 of the nonstick layer 4 so as to create an embrittlement plane in the underlying peripheral portion 8 of the support substrate 1. Then, a heat treatment of exfoliation is applied so as to obtain a blistering of the material leading to the formation of the recess 9. Again, this method is very precise and makes it possible to respect an excellent homogeneity of the width L and the height H of the recess 9. All these methods described above also make it possible to obtain a recess 9 whose bottom 11 has a fairly large roughness, generally between 1 and 10 nanometers with the clipping saw or photolithography followed by ion etching, and between about 1 and 500 nanometers with ion implantation. This roughness is favorable for the subsequent obtaining of a large bonding energy when placed in contact with a substrate 3.
    [0011] According to a variant not illustrated, the trimming 9 has a profile which differs from that shown in Figures 4 to 6 in that its profile has a curved shape, a bevel or other. It is understood that the dimensions of the recess 9 remain homogeneous on the peripheral periphery of the support substrate 1 for all the profiles considered.
    [0012] As illustrated in FIG. 4, a substrate 3 of which a front face 12 is intended for the manufacture of electronic components is brought into contact with the substrate-handle 100 (step e). The substrate 3 is composed of sapphire but may also be selected from silica, silicon, glass, germanium or a metal such as molybdenum, tungsten and copper. The rear face 13 of the substrate 3 has been prepared beforehand by the deposition of an adhesive layer 14 (step f). According to a possibility not illustrated, this adhesive layer 14 could alternatively or additionally be also deposited on the face comprising the recess 9 of the handle substrate 100. This adhesive layer 14 is for example deposited by spinning a ZoneBond adhesive. ® 51.50 (supplied by Brewer Science) to a thickness of between about 10 and 100 microns and preferably about 50 microns. According to a variant not illustrated, the adhesive layer 14 could be obtained by depositing HT1010 or WaferBOND® CR-200, supplied by Brewer Science. Substrate 3 thus prepared was dried at 90 ° C for 10 minutes and then subjected to heat treatment at 200 ° C for 2 minutes to remove solvent from the adhesive. Finally, the rear face 13 of the substrate 3 is brought into contact with the substrate-handle 100 in a vacuum so that the adhesive layer 14 contacts the bottom 11 of the recess 9. The stack thus formed is subjected to a heat treatment. about 210 ° C accompanied by a compression of 6kN applied for 4 min. The formation of an adhesive layer bead 14 at the edge of the substrate 3 is avoided by the presence of the recess 9. As a result, the flatness of the adhesive layer 14 is improved and the bonding is optimized in comparison with that obtained with a substrate-handle 100 not cut-off. At the end, a bonding of an energy of approximately 600 mJ / m 2 is obtained between the handle substrate 100 and the substrate 3. According to a variant not illustrated, the rear face 13 and / or the front face 12 of the substrate 3 has undergone one or more preparatory steps prior to bonding, for future applications, such as patterning. As illustrated in Figure 5, the front face 12 of the substrate 3 secured to the handle substrate 100 is subjected to one or more steps for the manufacture of electronic components that would have been difficult to achieve without temporary bonding (step h). These steps include, for example, rectification, thinning, chemical mechanical polishing, etching, dielectric or metal deposition, pattern formation, passivation or heat treatment.
    [0013] As illustrated in FIG. 6, once these steps have been performed, a mechanical stress applied by a blade to the interface between the handle substrate 100 and the substrate 3 makes it possible to obtain separation of the substrate 3 (step i). . Alternatively, the mechanical stress is exerted by applying a tensile and / or shearing force or by bending the assembled structure. According to yet another variant, step i) is carried out by chemical etching in addition to or without the application of mechanical stress. The handle substrate 100 then recovered has a portion of the adhesive layer 14 transferred to the peripheral portion 8 of the support substrate 1 corresponding to the width L of the recess 9. A portion of the adhesive layer 14 remaining in the central region of the substrate 3 and corresponding to the central region 5 of the nonstick layer 4 of the substrate-handle 100 indicates the good adhesion obtained by the temporary bonding. The handle substrate 100 is then rinsed with limonene and rinsed with isopropanol (step j). The portion of residual adhesive layer 14 in the central region of the substrate 3 can also be eliminated by cleaning carried out under the same conditions. Once the adhesive layer portion 14 has been removed and the handle substrate 100 air-dried for about 5 minutes, the handle substrate 100 is recycled in a temporary bond-release cycle with a new substrate 3 (step k) . According to an alternative embodiment, the temporary bonding method according to the invention is made from a substrate-handle 100 whose width L 10 of the recess 9 has a dimension of about 3 mm. The bonding energy obtained at the end of step g) is about 130 mJ / m 2. Furthermore, the process of the invention carried out under the conditions described above and from a substrate-handle 100 without recess 9 leads to a bonding energy of 60mJ / m2. The trimming thus makes it possible to increase the bonding energy in correspondence with the width L of the recess 9. It is thus possible thanks to the present invention to modulate the bonding energy between the substrate-handle 100 and the substrate. 3 according to the width L of the clipping performed. This widens the window of accessible processes on the substrate 3 quickly and inexpensively, while ensuring adequate separation. It goes without saying that the invention is not limited to the embodiments described above as examples but that it includes all the technical equivalents and variants of the means described as well as their combinations.
    权利要求:
    Claims (15)
    [0001]
    REVENDICATIONS1. A method of manufacturing a substrate-handle (100) for temporarily bonding a substrate (3), characterized in that the method comprises the steps of: a) providing a support substrate (1) comprising a receiving face (2), b) depositing a nonstick layer (4) on the receiving face (2), the nonstick layer (4) comprising a central region (5) and a peripheral region (6), and c) Trimming the substrate support (1) so as to remove the peripheral region (6) of the release layer (4) and form a recess (9) at the periphery of the support substrate (1), in order to obtain the handle substrate (100). 15
    [0002]
    The method of claim 1, wherein step c) comprises removing material from the periphery of the support substrate (1) and the peripheral region (6) of the release layer (4) so that the recess (9) has a width L, measured from the periphery towards the substrate center support (1), substantially constant.
    [0003]
    3. Method according to one of claims 1 to 2, wherein the clipping of step c) is performed by means of machining tools, such as a clipping saw or grinder. 25
    [0004]
    4. Method according to one of claims 1 to 2, wherein the clipping of step c) is performed by a photolithography step followed by an ion etching step or chemical etching. 30
    [0005]
    5. Method according to one of claims 1 to 2, wherein the clipping of step c) is performed by a step of implantation of ionic species, such as hydrogen, through the peripheral region (6). ) of the nonstick layer (4) followed by an exfoliation heat treatment step.
    [0006]
    6. Method according to one of claims 1 to 5, wherein the support substrate (1) comprises a material selected from silicon, silica, glass, sapphire, germanium or a metal.
    [0007]
    A method of temporarily bonding a substrate (3) to a handle substrate (100), characterized in that the method comprises the steps of: d) providing the handle substrate (100) manufactured according to one of Claims 1 to 6, e) Providing the substrate (3) comprising a rear face (13) and a front face (12), the front face (12) being intended to receive electronic components, f) Depositing an adhesive layer (14) on the rear face (13) of the substrate (3) and / or on the face of the handle substrate (100) having the recess (9), and g) contacting the rear face (13) of the substrate ( 3) and the face 20 of the handle substrate (100) having the recess (9) via the adhesive layer (14) so as to obtain the temporary bonding of the substrate (3) to the handle substrate (100).
    [0008]
    The method of claim 7, wherein the substrate (3) comprises a material selected from silicon, silica, glass, sapphire, germanium or a metal.
    [0009]
    9. Method according to one of claims 7 to 8, wherein the method comprises after step g), a step h) of applying to the front face (12) of the substrate (3) at least one step of processing for the manufacture of electronic components, such as grinding, thinning, chemical mechanical polishing, etching, dielectric or metal deposition, pattern formation, passivation, heat treatment, or a combination of at least one of these treatments.
    [0010]
    The method according to one of claims 7 to 9, wherein the process comprises after step g), a step i) of etching and / or applying a mechanical stress so as to separate the substrate (3) of the handle substrate (100).
    [0011]
    11. The method according to one of claims 7 to 10, wherein the method comprises after step i) a step j) of cleaning the substrate-handle (100) to remove the glue residue so that the substrate -Handle (100) can be reused in step d).
    [0012]
    The method of claim 11, wherein the method comprises a step k) performed after step j) of repeating at least once steps d) to i).
    [0013]
    Handle substrate (100) for the temporary bonding of a substrate (3), characterized in that the handle substrate (100) comprises a support substrate (1) whose periphery has a recess (9), recess (9) delimiting a central portion (7) of the support substrate (1) covered with a nonstick layer (4), the recess (9) being free of a nonstick layer (4). 25
    [0014]
    The handle substrate (100) according to claim 13, wherein the recess (9) has a width (L), measured from the periphery to the center of the support substrate (1), of between 1 to 50 mm, the width (L) varying by plus or minus 1 micrometer along the periphery of the support substrate (1). 30
    [0015]
    15. Substrate-handle (100) according to one of claims 13 to 14, wherein the recess (9) has a bottom (11) whose roughness is between 1 and 500 nm RMS.
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    同族专利:
    公开号 | 公开日
    FR3015110B1|2017-03-24|
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    EP3084817A1|2016-10-26|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US6117778A|1998-02-11|2000-09-12|International Business Machines Corporation|Semiconductor wafer edge bead removal method and tool|
    US20060292887A1|2005-06-24|2006-12-28|Seiko Epson Corporation|Manufacturing method for a semiconductor device|
    US20110069467A1|2008-01-24|2011-03-24|Brewer Science Inc.|Method for reversibly mounting a device wafer to a carrier substrate|
    US20120038060A1|2010-08-13|2012-02-16|MOS Art Pack Corporation|Stacking method and stacking carrier|
    WO2013006865A2|2011-07-07|2013-01-10|Brewer Science Inc.|Methods of transferring device wafers or layers between carrier substrates and other surfaces|
    US20130248099A1|2012-03-23|2013-09-26|Kabushiki Kaisha Toshiba|Method of manufacturing a semiconductor device and substrate separating apparatus|EP3626450A1|2018-09-24|2020-03-25|Commissariat à l'énergie atomique et aux énergies alternatives|Method for stripping a substrate by transferring a thermoplastic polymer surface film|
    EP3823013A1|2019-11-14|2021-05-19|Commissariat à l'Energie Atomique et aux Energies Alternatives|Method for dismantling a stack of at least three substrates|
    FR3077283B1|2018-01-30|2021-09-17|Commissariat Energie Atomique|METHOD OF ENCAPSULATION OF A MICROELECTRONIC DEVICE, INCLUDING A STAGE OF THINNING OF THE SUBSTRATE AND / OR OF THE ENCAPSULATION HOOD|
    FR3113771A1|2020-08-27|2022-03-04|Commissariat A L'energie Atomique Et Aux Energies Alternatives|Process for the manufacture of a substrate-handle intended for the temporary bonding of a substrate.|
    法律状态:
    2015-11-16| PLFP| Fee payment|Year of fee payment: 3 |
    2016-10-20| PLFP| Fee payment|Year of fee payment: 4 |
    2017-10-26| PLFP| Fee payment|Year of fee payment: 5 |
    2018-10-18| PLFP| Fee payment|Year of fee payment: 6 |
    2019-10-24| PLFP| Fee payment|Year of fee payment: 7 |
    2021-09-10| ST| Notification of lapse|Effective date: 20210806 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1362845A|FR3015110B1|2013-12-17|2013-12-17|METHOD FOR MANUFACTURING A HANDGRIP SUBSTRATE FOR TEMPORARY BONDING OF A SUBSTRATE|FR1362845A| FR3015110B1|2013-12-17|2013-12-17|METHOD FOR MANUFACTURING A HANDGRIP SUBSTRATE FOR TEMPORARY BONDING OF A SUBSTRATE|
    KR1020167019274A| KR20160098472A|2013-12-17|2014-12-15|Process for fabricating a handle wafer intended to be temporarily bonded to a substrate|
    EP14824062.5A| EP3084817A1|2013-12-17|2014-12-15|Process for fabricating a handle wafer intended to be temporarily bonded to a substrate|
    PCT/FR2014/053354| WO2015092254A1|2013-12-17|2014-12-15|Process for fabricating a handle wafer intended to be temporarily bonded to a substrate|
    US15/105,847| US9934995B2|2013-12-17|2014-12-15|Method for manufacturing a handle substrate for the temporary bonding of a substrate|
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